| 摘要 |
Electrical connection is ensured between an electronic component (9) using an anisotropic conductive film (12) and electrodes (6). An adhesive film (20) is affixed to a back surface side in an implementation region (10) of a flexible substrate (11), and the electronic component (9) is mounted on a front surface side. The adhesive film (20) comprises a base material film (22) with an adhesive agent layer (21) formed thereon, the adhesive agent layer (21) including an adhesive agent (26) containing spherical particles (25) with a diameter of not less than 75% and not more than 95% of the film thickness of the adhesive agent layer (21). When the anisotropic conductive film (12) is disposed in the implementation region (10) and the electronic component (9) is mounted thereon by heating and pressing, as the adhesive agent layer (21) is heated and pressed so as to push out the adhesive agent (26), the individual spherical particles (25) contact the base material film (22) and the flexible substrate (11), whereby the film thickness of the adhesive agent layer (21) does not become smaller than the diameter of the spherical particles (25), while the conductive particles (19) held between bumps (13) and the electrodes (6) are pressed and crushed, ensuring electrical connection. |
