BONDING STRENGTH TEST DEVICE FOR ELECTRONIC COMPONENTS AND METHOD FOR BONDING STRENGTH TEST

摘要

According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.

主权项

1. A bonding strength test device configured to measure a bonding strength between a flexure of a suspension of a hard disk drive and electronic components mounted on a gimbal of the flexure, the bonding strength test device comprising:
a clamp which fixes the flexure; a dummy adhered to the electronic components; a probe which engage with the dummy; and a device body which measures a tensile load applied to the probe while the probe being pulled toward a direction to be apart from the flexure.