MOLD UNDERFILL MATERIAL FOR COMPRESSION MOLDING, SEMICONDUCTOR PACKAGE, STRUCTURE, AND PROCESS FOR PRODUCING SEMICONDUCTOR PACKAGE

摘要

A mold underfill material for compression molding with which a semiconductor element disposed on a substrate is encapsulated and the gap between the substrate and the semiconductor element is filled, the underfill material comprising an epoxy resin (A), a hardener (B), and an inorganic filler (C) and being powder particles. When the mold underfill material is examined using a Curelastometer under the conditions of a mold temperature of 175ºC, the time T(5) required for the torque to reach 5% of the maximum value from initiation of the measurement is 25-100 seconds.