| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus for depositing a thin film on a flexible substrate that has the whole apparatus downsized and efficiency improved to enhance productivity.SOLUTION: In a film deposition apparatus, a thin film is deposited on a flexible substrate 205 making use of vacuum. The apparatus includes at least a first zone 101 where a first gas is introduced and a second zone 102 where a second gas is introduced in a vacuum chamber 100, wherein a zone separator 202 separating the two zones has an opening through which the flexible substrate 205 passes. The apparatus further includes a mechanism for conveying the flexible substrate 205 in the zones, a mechanism 501 for supplying the first zone 101 with a raw gas containing a metal or silicon, and a mechanism for sputtering a material containing the metal or silicon as a target material in the second zone 102.SELECTED DRAWING: Figure 1 |
