| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can improve bondability with an electronic component such as a semiconductor element and a crystal oscillator.SOLUTION: A wiring board manufacturing method according to the present embodiment comprises the steps of: forming on an insulation layer, a first conductor layer functioning as a seed layer; forming on the first conductor layer, a resist layer having an opening of a predetermined pattern; forming on the first conductor layer exposed from the opening, a second conductor layer by electrolytic plating; and grinding a surface of the second conductor layer by a No.800-1500 count ceramic buff.SELECTED DRAWING: Figure 1 |
