| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder powder that, after reflow, is less likely to remelt and cause bond strength reduction and that is suitable for packaging of electronic component or the like exposed to a high-temperature atmosphere, and to provide a solder paste using the powder.SOLUTION: There is provided a solder powder 10 which composed of a center core 11 and a coat layer 12 covering the center core 11 and in which the center core 11 is made of nickel and an intermetallic compound between nickel and tin, and the coat layer 12 is made of tin, and the solder powder 10 is characterized in that the average particle size of the solder powder 10 is 1 to 30 μm and the contained ratio of nickel per entire amount of solder powder 10 of 100 mass% is more than 3.0 mass% and 65 mass% or less.SELECTED DRAWING: Figure 1 |
