MINIATURE MULTILAYER RADIATIVE COOLING CASE WITH HIDDEN QUICK RELEASE SNAPS

摘要

A passive cooling arrangement for an electronic housing assembly is disclosed which comprises a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion, the substantially flat peripheral portion facing and being nearly coextensive with an outer wall of said housing assembly, and the depression portion being in thermal engagement with the heat generating component on the circuit board, whereby heat generated by the heat generating component can be passively thermally conducted through the depression portion and into the substantially flat peripheral portion of the heat sink, and thereafter dissipated in a generally uniform manner through the outer wall of the housing assembly. The frame comprises a base with embosses which support the circuit board in a position enabling the thermal engagement of the heat generating component and the depression portion of the heat sink. The outer wall of the housing assembly is preferably unvented and the housing assembly is preferably oriented in use with the outer wall facing upwardly.