FLOODING DEVICE FOR A HORIZONTAL GALVANIC OR WET-CHEMICAL PROCESS LINE FOR METAL DEPOSITION ON A SUBSTRATE

摘要

The present invention is related to a flooding device for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated, wherein the flooding device comprises at least a flooding element and at least a first substrate guiding element, wherein said flooding element is mechanically connected to the at least first substrate guiding element, and wherein the first substrate guiding element is spatially arranged on the entry side of the flooding element. The present invention is further related to a treating module of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated comprising at least one pair of oppositely arranged such flooding devices.