发明名称 半導体装置及びその製造方法
摘要 Disclosed is a semiconductor device (10) which is embedded with a non-volatile element (100) in which a state immediately preceding the supply of power is maintained even when power is no longer supplied. The non-volatile element (100) is provided with a variable resistor film (40), and an upper electrode (50) and lower electrode (wiring (31)) for the variable resistor film (40). The variable resistor film (40) is electrically connected to a lower layer wiring (wiring (31)) disposed on the lower layer side of the variable resistor film (40) and to an upper layer wiring (wiring (32)) disposed on the upper layer side. The lower electrode (wiring (31)) also functions as the lower layer wiring. Moreover, the upper electrode (50) has an upper surface which is formed with steps (S) between a center section (P1) and an outer circumferential section (P2), and the center section (P1) and the outer circumferential section (P2) are electrically connected to the upper layer wiring (wiring (32)) via a barrier metal film (32a).
申请公布号 JP5999768(B2) 申请公布日期 2016.09.28
申请号 JP20120514820 申请日期 2011.05.11
申请人 日本電気株式会社 发明人 多田 宗弘;阪本 利司;波田 博光
分类号 H01L27/105;H01L21/82;H01L27/10;H01L45/00;H01L49/00 主分类号 H01L27/105
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