PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE

摘要

An optical semiconductor element housing package includes a base body (1) having an optical semiconductor element mounting portion (1a) on an upper main surface thereof; a frame body (2) joined to the base body (1) so as to surround the mounting portion (1a); and an optical fiber securing member (3) fitted in a through hole (2c) which penetrates through from an inside to an outside of the frame body (2). The frame body (2) is formed by bending a single strip-like plate member at its several positions, and then bonding one end (2a) side and an other end (2b) side thereof, the through hole (2c) being provided so as to be located at a juncture of the one end (2a) side and the other end (2b) side. By bonding with the interposition of the optical fiber securing member (3) fitted in the through hole (2c), an easy optical semiconductor element housing package characterized by easy assembling and a uniform joining force is obtained.