| 摘要 |
Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder. |
