发明名称 THERMOSETTING COMPOSITION
摘要 There is provided a resin composition that can allow a drying step after impregnation coating of a prepreg and lamination pressing to be performed at low temperatures in a short time and, at the same time, can maintain storage stability of the prepreg. The resin composition according to the present invention comprises (A) an imidazole compound represented by formula (I), (B) an epoxy compound, and (C1) a cyanate compound or (C2) a BT resin. In the formula, R 1 and R 2 each independently represent an alkyl group having 3 to 18 carbon atoms, an alkenyl group having 3 to 18 carbon atoms, an alkoxyl group having 3 to 18 carbon atoms, or a substituted or unsubstituted aromatic substituent having 6 to 14 carbon atoms; and R 3 represents hydrogen, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, a substituted or unsubstituted aromatic substituent having 6 to 14 carbon atoms, or a halogen group.
申请公布号 EP2562196(A4) 申请公布日期 2016.09.28
申请号 EP20110772009 申请日期 2011.04.19
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 MABUCHI YOSHINORI;SOGAME MASANOBU;ARII KENJI;OHTSUKA HAJIME;FUKASAWA EMI
分类号 C08G59/68;B32B15/08;C08J5/24;C08L63/00 主分类号 C08G59/68
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