发明名称 POLISHING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND METHOD FOR OUTPUTTING A DRESSING CONDITION
摘要 The present invention provides a polishing apparatus and a control method thereof, capable of uniformly polishing a polishing pad with a small dresser. According to the present invention, the polishing apparatus comprises: a turntable (11) having a polishing pad (11a) to polish a substrate (W); a turntable rotating apparatus (12) to rotate the turntable (11); a dresser (51) cutting the polishing pad (11a) to dress the polishing pad (11a); and a scanning apparatus (56) to make the dresser (51) perform scanning between a first and a second position on the polishing pad (11a). When a rotation cycle of the turntable (11) is Ttt during dressing, and a scanning cycle is Tds while the dresser (51) performs scanning between the first and the second position, Ttt / Tds and Tds / Ttt are not integers.
申请公布号 KR20160112992(A) 申请公布日期 2016.09.28
申请号 KR20160031253 申请日期 2016.03.16
申请人 EBARA CORPORATION 发明人 SHINOZAKI HIROYUKI
分类号 H01L21/304;B24B53/017;B24B53/02;H01L21/306;H01L21/461;H01L21/687 主分类号 H01L21/304
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