摘要 |
The present invention provides a polishing apparatus and a control method thereof, capable of uniformly polishing a polishing pad with a small dresser. According to the present invention, the polishing apparatus comprises: a turntable (11) having a polishing pad (11a) to polish a substrate (W); a turntable rotating apparatus (12) to rotate the turntable (11); a dresser (51) cutting the polishing pad (11a) to dress the polishing pad (11a); and a scanning apparatus (56) to make the dresser (51) perform scanning between a first and a second position on the polishing pad (11a). When a rotation cycle of the turntable (11) is Ttt during dressing, and a scanning cycle is Tds while the dresser (51) performs scanning between the first and the second position, Ttt / Tds and Tds / Ttt are not integers. |