| 摘要 |
Various embodiments of the present invention relate to methods and an apparatus for electroplating a substrate with cobalt. In most cases, the interiors of recessed pitchers are electroplated with cobalt. The recessed pitchers may include a seed layer such as a cobalt seed layer. Electroplating can be performed through a bottom-up mechanism. The bottom-up mechanism can be accomplished by using certain additives (for example, an accelerator or an inhibitor) which may exist at various concentrations in an electrolyte. In addition, a leveler, a wetting agent and/or a polish may be used to promote high quality results of plating. According to various embodiments of the present invention, the substrate is pre-treated to remove oxide (and carbon impurities in some cases) from the seed layer before performing electroplating. In addition, the electrolyte can have certain conductivity to promote constant plating results over the surface of the substrate. |
