| 摘要 |
The present invention aims to provide a foamable resin composition which enables foam molding at high expansion ratios and reduction of open cells. The present invention also aims to provide a foam molded body produced from the foamable resin composition. The present invention is a foamable resin composition including a thermoplastic resin, thermal expansion microcapsules, and a chemical foaming agent, wherein Ts is not lower than 120°C, Tmax is not lower than 190°C, and Ts - Tc is not lower than -30°C and not higher than 6°C, where Ts denotes a foaming starting temperature of the thermal expansion microcapsules, Tmax denotes a maximum foaming temperature of the thermal expansion microcapsules, and Tc denotes a decomposition temperature of the chemical foaming agent. |
