发明名称 |
RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONICS DEVICES AND ORGANIC ELECTRONICS DEVICE |
摘要 |
An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer,
wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40. |
申请公布号 |
EP2930210(A4) |
申请公布日期 |
2016.09.28 |
申请号 |
EP20130862355 |
申请日期 |
2013.11.28 |
申请人 |
ZEON CORPORATION |
发明人 |
TAZAKI, SATOSHI;KASHIWAGI, MOTOFUMI;ISHIGURO, ATSUSHI;KOIDE, YOHEI |
分类号 |
C08L53/02;C08F8/04;C08F8/06;C08F8/42;C08F297/04;H01L51/50;H05B33/04 |
主分类号 |
C08L53/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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