ETCHANT COMPOSITION FOR COPPER-CONTAINING METAL LAYER AND PREPARING METHOD OF AN ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY USING SAME

摘要

The present invention relates to an etchant composition for a copper-based metal film, and to a manufacturing method of an array substrate using the same for a liquid crystal display device. More particularly, the present invention relates to an etchant composition for etching a copper-based metal film, a manufacturing method of an array substrate using the same for a liquid crystal display device, and to an array substrate manufactured by using the manufacturing method for a liquid crystal displace device. The etchant composition comprises, based on the total weight of the etchant composition: 5-25 wt% of hydrogen peroxide; 0.1-5 wt% of a water soluble compound having a nitrogen-hydrogen (N-H) bond and a carboxylic group within a molecule; 0.1-10 wt% of an EGTA-based compound; 0.1-5 wt% of a phosphate compound; 0.1-5 wt% of organic acid excluding nitrogen atoms; 0.1-5 wt% of a water soluble cyclic amine compound; 0.01-1 wt% of a fluorinated compound; and the remainder consisting of water.