| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for giving a cured relief pattern with a good shape, which can be cured at low-temperature and prevents a pattern from being buried due to collapse of a relief pattern after curing; a cured relief pattern-formation method to form a pattern using the photosensitive resin composition; and a semiconductor device and a display device having the cured relief pattern.SOLUTION: A photosensitive resin composition comprises a phenol resin (A) having a structure represented by the general formula (1) [in the formula, a, b, Rand X are as defined in the description], a photosensitive diazonaphthoquinone compound (B) and a solvent (C). |
