发明名称 |
SEMICONDUCTOR PACKAGE ASSEMBLY WITH A METAL-INSULATOR-METAL CAPACITOR STRUCTURE |
摘要 |
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first semiconductor die (302). A first redistribution layer (RDL) structure (308) is coupled to the first semiconductor die. The first redistribution layer (RDL) structure includes a first conductive trace (452b) disposed at a first layer-level. A second conductive trace (454b) is disposed at a second layer-level. A first inter-metal dielectric (IMD) layerc (318) and a second intermetal dielectric (IMD) layer (456b), which is beside the first inter-metal dielectric (IMD) layer, are disposed between the first conductive trace and the second conductive trace, resulting in a metal-insulator-metal (MIM) capacitor structure. |
申请公布号 |
EP3073525(A2) |
申请公布日期 |
2016.09.28 |
申请号 |
EP20160159135 |
申请日期 |
2016.03.08 |
申请人 |
MEDIATEK, INC |
发明人 |
LIN, TZU-HUNG;PENG, I-HSUAN;HSIAO, CHING-WEN |
分类号 |
H01L23/522;H01L23/498;H01L23/538;H01L25/065;H01L25/10;H01L25/16 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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