ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT SERIES INCLUDING THE SAME

摘要

Provided is an electronic component capable of inhibiting the generation of cracks in the main body of the component caused by the thermal contraction of a solder fillet. The electronic component (1A) comprises: a main body (10A) of the component having an internal conductor (12) embedded therein; and an outer electrode (20A1) arranged on the outer surface of the main body (10A) of the component. The main body (10A) of the component includes: an end surface (10b1) having the internal conductor (12) exposed thereon; and a main surface (10a1) continuous with the end surface (10b1) and intersecting with the end surface (10b1). The outer electrode (20A1) includes: an end surface covering portion (20b) connected to the internal conductor (12) by covering at least a portion of the internal conductor (12) exposed on the end surface (10b1); and a main surface covering portion (10b) covering at least part of the main surface (10a1). At least part of an exposed surface of the main surface covering portion (10a1) is an Sn plating layer (24), and at least part of an exposed surface of the end surface covering portion (10b1) is an Sn-Ni layer (23).