| 摘要 |
PROBLEM TO BE SOLVED: To resolve a lack of a pressure when a flexible substrate is thermally pressurized.SOLUTION: In a manufacturing method, a flexible substrate 2 on one face 9a of which plural connection terminals 7 are aligned is arranged on a connection object 1 on which plural electrode terminals 6 connected to the connection terminals 7 are aligned, so that the connection terminals 7 are opposed via an adhesive 3. The substrate 2 is pressed via a cushioning material 20 from the other face 9b opposite to the face 9a on which the connection terminals 7 are formed, and the adhesive 3 is hardened, so as to manufacture a connection structure to which the substrate 2 is connected. A first dummy terminal 10 is formed on the substrate 2 at a position overlapping the connection terminals 7 on the other face 9b. |
