发明名称 半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor apparatus in which a semiconductor device is mounted on a metal basal portion, the semiconductor apparatus more stably operating by being given resistance against a noise from the basal portion.SOLUTION: A semiconductor apparatus 1 includes: a metal basal portion 2; a semiconductor device 10 mounted on the basal portion 2; an insulator 3 interposed between the basal portion 2 and the semiconductor device 10; and external connection terminals 4a and 4b provided in the basal portion while being insulated from the basal portion. The semiconductor apparatus 1 further includes an impedance structure part 20 which is attached to the basal portion 2 between the basal portion 2 and the semiconductor device 10 so as to be located in an intrusion path of a noise intruding from the basal portion 2 to the semiconductor device 10 via a parasitic capacitance between the basal portion 2 and the semiconductor device 10, and which shows a high impedance to the noise.
申请公布号 JP5998908(B2) 申请公布日期 2016.09.28
申请号 JP20120274552 申请日期 2012.12.17
申请人 株式会社デンソー 发明人 島倉 啓;加藤 久登;原田 峻丞
分类号 H01L23/12;H01F27/06;H01L23/00 主分类号 H01L23/12
代理机构 代理人
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