发明名称 半導体片の製造方法
摘要 A design method of a tip shape of a cutting member includes a process of forming a groove on a front surface side on a front surface of a substrate, and a process of forming a groove on a rear surface side that communicates with the groove on the front surface side by a rotating cutting member that has a thickness larger than the width of the groove on the front surface side from a rear surface of the substrate and individualizing the substrate into semiconductor pieces. The design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on the front surface side having the same shape, a process of confirming a breakage status when the groove on the rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.
申请公布号 JP5994832(B2) 申请公布日期 2016.09.21
申请号 JP20140205556 申请日期 2014.10.06
申请人 富士ゼロックス株式会社 发明人 皆見 健史;手塚 弘明;村田 道昭;山崎 憲二
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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