| 摘要 |
The present invention relates to a flexible complex substrate coated with polyimide. The flexible complex substrate has excellent thermal resistance, chemical resistance, heat radiating properties, flame resistance, mechanical/chemical characteristics, and the like. Also, the flexible complex substrate has remarkable processability and workability, and thus can be applied to various electronic devices. Also, the present invention relates to a preparation method of the flexible complex substrate, and a via hole structure of an electronic device comprising the same. |
