| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device which prevents the deterioration of cooling performance due to heat of a substrate and cools the substrate in a short time.SOLUTION: A cooling device 1 includes: a diaphragm part 2 which levitates a substrate W through ultrasonic vibrations; and an ultrasonic wave generation part 4 which provides the ultrasonic vibrations to the diaphragm part 2. The cooling device 1 includes a diaphragm cooling part 3 for cooling the diaphragm part 2 on the rear surface side of a surface of the diaphragm part 2 which levitates the substrate W. The diaphragm cooling part 3 includes a cool facing surface 34 facing a rear surface of the diaphragm part 2. The cool facing surface 34 is disposed so as to be spaced a predetermined distance away from the rear surface of the diaphragm part 2. |
