发明名称 縦型高耐圧半導体装置および縦型高耐圧半導体装置の製造方法
摘要 A silicon carbide vertical MOSFET includes an N-counter layer of a first conductivity type formed in a surface layer other than a second semiconductor layer base layer selectively formed in a low concentration layer on a surface of the substrate, a gate electrode layer formed through a gate insulating film in at least a portion of an exposed portion of a surface of a third semiconductor layer of a second conductivity type between a source region of the first conductivity type and the N-counter layer of the first conductivity type, and a source electrode in contact commonly with surfaces of the source region and the third semiconductor layer. Portions of the second conductivity type semiconductor layer are connected with each other in a region beneath the N-counter layer.
申请公布号 JP5995252(B2) 申请公布日期 2016.09.21
申请号 JP20140508244 申请日期 2013.03.29
申请人 富士電機株式会社;国立研究開発法人産業技術総合研究所 发明人 岩室 憲幸;原田 信介;星 保幸;原田 祐一
分类号 H01L29/78;H01L29/12;H01L29/739 主分类号 H01L29/78
代理机构 代理人
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