| 摘要 |
Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature at the time of soldering of an electrical component. In a circuit assembly 10 in which a busbar circuit unit 16 is overlapped with and fixed to a printed circuit board 12, the busbar circuit unit 16 is configured as one piece by busbars 14 being buried between insulator layers 22 and 26, and has an exposed section 44 in which a part of the busbars 14 is exposed via a through-hole 40 of the insulator layer 22. The insulator layer 22 of the busbar circuit unit 16 is overlapped with the printed circuit board 12 and is fixed thereto via fixing means 36, and terminal sections 56 of an electrical component 20 are soldered to and mounted on the exposed section 44 of the busbar circuit unit 16 and a printed wiring 54 of the printed circuit board 12. |
