发明名称 樹脂フィルムの表面処理方法、樹脂フィルムの成膜方法ならびに金属化樹脂フィルム基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method for surface-treating a resin film, capable of preventing abnormal discharge when the resin film is conveyed under reduced pressure atmosphere and preventing the damage of the resin film or a deposited film even though a long resin film, a method for depositing a film on the resin film, and a method for manufacturing a metalized resin film.SOLUTION: A method for surface-treating a resin film comprises: feeding a resin film F from a feeding roll 2 having the resin film F wound in a roll state under reduced pressure atmosphere; measuring charge potential of the resin film by a sensor 5 during conveyance by roll-to-roll; surface-treating at least one surface of the resin film having a charge potential of -7kV to +7kV; and winding the film on a winding roll 4.
申请公布号 JP5995145(B2) 申请公布日期 2016.09.21
申请号 JP20130094493 申请日期 2013.04.26
申请人 住友金属鉱山株式会社 发明人 猪狩 敦
分类号 C23C14/20;C23C14/14;C23C14/56;H05K1/03;H05K3/00 主分类号 C23C14/20
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