| 摘要 |
A bonding resin (45) that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin (43) and a bonding reinforcement resin (44) which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet (44a) being a wet-spreading portion or a portion which swells outward from the photosensitive resin. |
