| 摘要 |
[Problem] To obtain high thermal conductivity and reduce thermal resistance at the filler-resin interface in a heat-dissipating composite material using aluminum nitride as the filler. [Solution] A resin composition containing aluminum nitride particles, a heat-curable resin or a thermoplastic resin, and an alkyl acid phosphate having a specific structure is produced by mixing the aluminum nitride particles, the heat-curable resin or thermoplastic resin, and the alkyl acid phosphate having the specific structure. Molding and curing the resin composition makes it possible to obtain a resin-molded article having high thermal conductivity. |
