| 摘要 |
PROBLEM TO BE SOLVED: To easily bond a film to a chuck and cause the elastic film to suction a wafer without causing unevenness of adhesion strength.SOLUTION: A wafer suction device includes: a planar chuck (10) formed by a rigid material and generating a suction effect on its upper surface by vacuum; and an annular fixing member (52) having an inner diameter larger than an outer diameter of the chuck and fixing an elastic film having a number of suction holes to the inner side thereof. The annular member is moved down relative to the chuck, and the elastic film is stretched over the chuck with a uniform tensile force to be supported. The wafer is suctioned and held on the stretched elastic film. |
