发明名称 蒸着装置
摘要 PROBLEM TO BE SOLVED: To prevent a substrate from falling from a substrate holder even when a trouble occurs in electrostatic attraction.SOLUTION: A vapor deposition device includes, in a vacuum chamber, a vapor deposition source that vaporizes a vapor deposition material, a substrate holder 2 that holds a substrate 7 in a manner of causing the same to face the vapor deposition source, and a vapor deposition mask having a plurality of openings arranged to correspond to a plurality of pattern forming areas preset on a surface of the substrate 7, and forms a thin film pattern by vapor-depositing the vaporized vapor deposition material from the vapor deposition source onto the substrate 7 via the plurality of openings of the vapor deposition mask. The substrate holder 2 includes an electrostatic chuck disposed in the central area of a holding face 2b for holding the substrate 7, and a magnetic chuck disposed on the holding face 2b to correspond at least to both edge areas of the substrate 7, and is constructed to hold the substrate 7 by statically attracting the substrate 7 and by magnetically attracting magnetic metal plates 10 separately formed and disposed on both the edge areas of the surface of the substrate 7.
申请公布号 JP5994089(B2) 申请公布日期 2016.09.21
申请号 JP20110290297 申请日期 2011.12.29
申请人 株式会社ブイ・テクノロジー 发明人 水村 通伸
分类号 C23C14/24;H01L21/683;H01L51/50;H05B33/10 主分类号 C23C14/24
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