| 摘要 |
The present invention relates to a printed circuit board for installing LED modules and a manufacturing process thereof. The printed circuit board for installing LED modules forms a plurality of heat radiation apertures penetrating both surfaces on an insulating layer and simultaneously forms a heat radiation layer on an inner wall of the heat radiation apertures, a lower surface of a substrate and a back surface of an LED module exposed by means of heat radiation apertures and directly contacts the LED module with the heat radiation layer, thereby efficiently discharging heat generated from emitting lights of LED elements. The present invention forms heat radiation apertures of which the size is smaller than the back surface area of the LED module but bigger than a half of the back surface area, such that the area of heat radiation apertures is increased and heat generated from emitting lights of LED elements is easily moved to the outside through the heat radiation apertures, thereby increasing the heat radiation efficiency. When heat radiation paints are applied, the heat radiation paints are easily applied to the inner wall of the heat radiation apertures and the exposed surface of the LED module, thereby greatly reducing the time of processing, and increasing the pressure resistance and the heat radiation efficiency. |
