CHEMICAL MECHANICAL POLISHING PAD WITH WINDOW

摘要

Provided is a chemical mechanical polishing pad with a window, which comprises: a polishing layer; an ending point detection window; a sub-pad; and a stack adhesive. The sub-pad includes a plurality of openings optically communicating with the ending point detection window. A polishing surface of the polishing layer is formed to polish a substrate. The chemical mechanical polishing pad with a window maximizes polishing pad durability by minimizing a polishing defect caused by window protrusion, and reducing nonuniform window abrasion and related too early polishing pad disuse.