| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of controlling adsorption power more preferably.SOLUTION: An electrostatic chuck 1 holding a wafer W on an upper surface thereof includes a substrate 3 made of a dielectric body, a first electrode 5 arranged inside the substrate 3, and a second electrode 7 formed on an upper surface of the substrate 3. The substrate 3 has a plurality of pins 3b protruding from the upper surface of the substrate 3, and a bottom surface located between the plurality of pins 3b on the upper surface. The second electrode 7 is formed on the bottom surface, and has a solid state portion entirely extending over an area surrounded by the plurality of pins 3 on the bottom surface. |
