发明名称 プラズマ処理装置
摘要 The purpose of the present invention is to treat the surfaces of multiple articles of interest with plasma uniformly. A holder (21) in which multiple substrates (11) are housed is set in a vacuum treatment chamber (14). First and second electrodes (41, 42) are arranged with being spaced apart from each other between the holder (21) and an inlet port (38). A process gas discharged through the inlet port (38) is excited with the first and second electrodes (41, 42) to generate plasma. The generated plasma is supplied to the inside of the holder (21) through a side opening provided on a side plate (22) of the holder (21), and removes contaminants on the surfaces of the substrates (11).
申请公布号 JP5996654(B2) 申请公布日期 2016.09.21
申请号 JP20140531421 申请日期 2012.08.22
申请人 株式会社JCU 发明人 佐波 正浩;上山 浩幸
分类号 H05H1/46;C23F4/00;C23G5/00;H01L21/304;H01L21/3065;H05K3/26 主分类号 H05H1/46
代理机构 代理人
主权项
地址