发明名称 |
Method of polishing back surface of substrate and substrate processing apparatus |
摘要 |
A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety. |
申请公布号 |
EP2762274(B1) |
申请公布日期 |
2016.09.21 |
申请号 |
EP20140020010 |
申请日期 |
2014.01.29 |
申请人 |
EBARA CORPORATION |
发明人 |
ISHII, YU;ITO, KENYA;NAKANISHI, MASAYUKI;TOGAWA, TETSUJI |
分类号 |
B24B37/04;B24B7/22;B24B21/00;B24B37/30 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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