SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEROF

摘要

A semiconductor structure includes a plurality of devices; a molding surrounding the plurality of devices and including a first surface adjacent to an active component of at least one of the plurality of devices and a second surface opposite to the first surface; and a shielding structure disposed within the molding and between two or more of the plurality of devices, wherein the shielding structure includes a first surface adjacent to the first surface of the molding and a second surface adjacent to the second surface of the molding, and the second surface of the shielding structure includes a recessed unit recessed toward the first surface of the molding.