APPARATUS AND METHOD FOR INSPECTING SMT FAULTY

摘要

Disclosed are an apparatus and a method for inspecting the defect of a surface mount technology (SMT). The apparatus for inspecting the defect of an SMT, according to an embodiment of the present invention, comprises: a differencing part which obtains difference images by differencing a vertical lighting image photographed by applying vertical light to a printed circuit board processed through the SMT and a horizontal lighting image photographed by applying horizontal light to the printed circuit board; a feature extracting part which extracts M (M >= 1) feature values with respect to each component area in the difference images; and a classifying part which classifies the M feature values on the basis of a preset reference feature value to classify the defect types of each component area in the printed circuit board.