MULTI LAYERED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND CIRCUIT BOARD HAVING THE SAME

摘要

The present invention relates to a multilayer ceramic electronic component, a manufacturing method thereof, and a circuit board on which an electronic component is mounted. The multilayer ceramic electronic component comprises: a ceramic body which includes a plurality of ceramic stacking units having a plurality of dielectric layers and a plurality of internal electrodes individually, and has a first side and a second side facing in a first direction, a third side and a fourth side facing in a second direction, and a fifth side and a sixth side facing in a third direction; and a plurality of external electrodes disposed on an outer side of the ceramic body, individually having a base electrode layer connected to the internal electrode of the ceramic stacking unit and a resin electrode layer disposed on the base electrode layer to expose at least a portion of the end of the base electrode layer.