发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 According to the present invention, provided is a technique capable of washing a substrate having a porous film on a surface layer while restricting damage. A substrate processing method to process a substrate (9) having a porous film (90), which has a porous structure, on a surface layer comprises the following processes: a) mixing a first processing liquid containing water with gas to form droplets of the first processing liquid, and spraying the droplets of the first processing liquid towards the porous film (90); and b) after the process a), mixing a second processing liquid, which is an organic solvent of a higher volatility than that of the first processing liquid, with gas to form droplets of the second processing liquid, and spraying the droplets of the second processing liquid towards the porous film (90).
申请公布号 KR20160110314(A) 申请公布日期 2016.09.21
申请号 KR20160112697 申请日期 2016.09.01
申请人 SCREEN HOLDINGS CO., LTD. 发明人 KOBAYASHI KENJI
分类号 H01L21/02;H01L21/302 主分类号 H01L21/02
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