PROCESS FOR FORMING SOLDER RESIST PATTERNS

摘要

The present invention provides a method for forming a solder resist pattern which does not produce a residue of solder resist on a connection pad to manufacture a wiring board having excellent reliability for electrical connection. The method for forming a solder resist pattern sequentially comprises: a process of forming a solder resist layer on a circuit board having a connection pad; and a process of thinning the solder resist layer which is not hardened until the thickness of the solder resist layer becomes thinner than or equal to the thickness of the connection pad. The solder resist layer at least contains (A) a polymer containing a carboxylic group, (B) a polymeric compound, (C) filler, and (D) a photopolymerization initiator. The acid value of (A) the polymer containing a carboxylic group is 80-150 mgKOH/g or the average particle diameter of (C) the filler is at least 1.1 times surface roughness (Ra) on the connection pad.