| 摘要 |
The present invention relates to a semiconductor chip package using a clip, for bonding semiconductor chips as well as a substrate and a semiconductor chip, constituting a package module, by using a clip, and to a method for manufacturing the same. More particularly, the present invention relates to a semiconductor chip package using a clip, capable of bonding the clip on the semiconductor chip in a package assembly process by forming a pad on a wafer having multiple semiconductor chips deposited thereon in advance, and to a method for manufacturing the same. |
