摘要 |
A circuit for detecting chipping, which detects a crack of a semiconductor chip, includes a plurality of corner segments, a plurality of connection segments, and an input/output circuit. The plurality of corner segments are arranged adjacent to a neighboring area of the semiconductor chip and are arranged on one or more conductive layers of the semiconductor chip. The plurality of connection segments interconnects at least the plurality of corner segments, are arranged adjacent to a neighboring area of the semiconductor chip, and are arranged on an upper conductive layer of the semiconductor chip. The input/output circuit is connected to an input segment among the plurality of connection segments through an input terminal, is connected to an output segment among the plurality of connection segments through an output terminal, receives an input signal, and provides an output signal in response to the input signal. |