发明名称 レーザ加工装置
摘要 PURPOSE: A laser processing apparatus is provided to efficiently heat the periphery of a portion in which a chemical vapor deposition (CVD) process is performed, and to reduce the deformation of a target which will be processed. CONSTITUTION: A laser processing apparatus includes a cooling air feeding unit (167) and a laser unit (163) irradiating a laser beam to a portion which will be processed. The cooling air feeding unit jets material gas and hot air to the periphery of the portion on a target to be processed. The cooling air feeding unit jets the cooling air to the periphery from the outside a position from which the material gas and the hot air are jetted. An exhaust outlet for sucking the material gas, the hot air, and the cooling air is installed between the position from which the material gas and the hot air are jetted and a position from which the cooling air is jetted. [Reference numerals] (101A) Fixing unit; (101B) Operating unit; (112) Glass loading board; (151) Processing unit; (152) Control unit; (161) Gas window; (162) Laser irradiation monitoring unit; (163) Laser unit; (164) Gas supply exhaust unit; (165) Air heater; (166) Air heater control unit; (167) Cooling air feeding unit
申请公布号 JP5994090(B2) 申请公布日期 2016.09.21
申请号 JP20120044034 申请日期 2012.02.29
申请人 株式会社ブイ・テクノロジー 发明人 中塚 敬一
分类号 C23C16/48 主分类号 C23C16/48
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