| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves downsizing and has high reliability; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 10 comprises: a semiconductor chip 1; a first wiring board 2 bonded to a rear face of the semiconductor chip 1; a plurality of conductors 11 bonded to surface electrodes of the semiconductor chip 1; and a second wiring board 12 integrated with conductors 11. The conductors 11 pierce through holes 12a provided in the second wiring board 12, respectively, and are integrated with the second wiring board 12. Each of other ends 11d of the conductors 11 is divided by a slit 11c. Each of divided parts (divided chip parts) 11b on the other end 11d side of the conductor 11 overlap the divided chip part 11b of the other conductor 11 by bending and are touchable. At a part 14 where the divided tip parts 11b overlap each other, the divided tip parts 11b of the different conductors 11 are bonded via a bonding layer 15. |
