| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device in which reduction in cooling efficiency due to the transfer of heat from a package to a Peltier element is suppressed.SOLUTION: In a thermoelectric conversion device 1A, when, out of three side surfaces of a package 20 facing other three end surfaces excluding a feeding side end surface of a heat dissipation substrate 13, the side surface whose distance between end surfaces of a cooling substrate 12 respectively facing three side surfaces is the shortest is defined as an adjacent side surface, the cooling substrate 12 is formed so that the distance between the adjacent side surface and the end surface of the cooling substrate 12 facing the adjacent side surface becomes longer than that between the adjacent side surface and the end surface of the heat dissipation substrate 13 facing the adjacent side surface.SELECTED DRAWING: Figure 1 |
