| 摘要 |
An IC module for installation in a portable data carrier and for electrical connection with an electronic device located in the data carrier supports at least two different connection technologies. It carries for this purpose contacting elements having a first set of contacting pads for a first connection technology and a second set of contacting solder areas for a second connection technology. A contacting pad of the first set of contacting pads in each case is connected electroconductively to a contacting pad of the second set of contacting pads. The connection can preferably be electively effected by a pressure-form technology or by means of connection wires as a soldered connection. |
