发明名称 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法
摘要 An electromagnetic field coupling structure that is used in a microwave band frequency band, includes: a laminated body in which an inner dielectric layer 23 is sandwiched and laminated between a plurality of inner conductor layers 12 and 15 which become a plurality of ground layers; a pair of outer dielectric layers 21 and 25 facing each other with the laminated body interposed therebetween; and a pair of outer conductor layers 11 and 16 facing each other with the pair of outer dielectric layers 21 and 25 interposed therebetween. The laminated body is provided with a hole S which penetrates the inner dielectric layer 23 and the inner conductor layers 12 and 15 which become the plurality of ground layers, and the inner conductor layers 12 and 15 which become the plurality of ground layers are electrically connected via a tubular metal film 3 formed on an inner wall of the hole S, whereby the pair of outer conductor layers 11 and 16 are electromagnetically coupled.
申请公布号 JP5990828(B2) 申请公布日期 2016.09.14
申请号 JP20110022964 申请日期 2011.02.04
申请人 日立化成株式会社 发明人 水嶋 悦男;近藤 裕介;渡辺 靖;水野 康之
分类号 H05K3/46;H01P1/04;H01P3/08;H01P5/107 主分类号 H05K3/46
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