| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat stabilizer composition for synthetic resin which contains no solid and exhibits excellent heat resistance, low viscosity and good handleability, a synthetic resin composition, and a molded product using the same.SOLUTION: A diester compound of the general formula (1) (more than 65 pts.mass) and a monoester compound of the general formula (2) account for 100 pts.mass in total. The mass ratio of the diester compound of the general formula (1) plus the monoester compound of the general formula (2) to a thiodialkylcarboxylic acid dialkyl ester compound satisfies {(1)+(2)}/(3)=95/5 to 50/50. |
